The materials currently in the database are ones commonly used in the construction of cryogenic hardware.
Ceramic thermal conductivity cryogenic.
The problem with the thermal conductivity of ceramics is the dependence on the composition grain size and manufacturing process which make it rather difficult to obtain a reliable value from literature only.
Looking at the values quoted in various handbooks papers and data sheets two things are observed.
Since ceramic materials have good mechanical properties and favorable thermal properties low thermal conductivity and thermal expansion they can be used as adequate materials in cryogenic engineering.
Ceramics especially zirconia based ceramics have been an attractive candidate for fundamental research at cryogenic temperatures due to their favorable mechanical properties corrosion resistance.
Not all properties are available for all materials.
Abstract the thermal conductivity and specific heat of a commercial machinable ceramic have been measured to 0 06 k.
The lower this value for a material is the lower its thermal conductivity and the better it is at avoiding thermal bridges.
The thermal conductivity is specified by the unit of measure w m k.
However the efficiency of cryogenic insulation materials is not solely determined by low thermal conductivity.